(module SOIC_clipProg (layer F.Cu) (tedit 5C48812E)
  (fp_text reference J3 (at 4.25 0 270) (layer F.SilkS))
  (fp_text value CONN_soicProg (at 0 3.175) (layer F.Fab))
  (pad 5 smd oval (at -1.905 0) (size 0.8 3) (layers B.Cu B.Mask))
  (pad 4 smd oval (at -1.905 0) (size 0.8 3) (layers F.Cu F.Mask))
  (pad 3 smd oval (at -0.635 0) (size 0.8 3) (layers F.Cu F.Mask))
  (pad 2 smd oval (at 0.635 0) (size 0.8 3) (layers F.Cu F.Mask))
  (pad 1 smd oval (at 1.905 0) (size 0.8 3) (layers F.Cu F.Mask))
  (pad 6 smd oval (at -0.635 0) (size 0.8 3) (layers B.Cu B.Mask))
  (pad 7 smd oval (at 0.635 0) (size 0.8 3) (layers B.Cu B.Mask))
  (pad 8 smd oval (at 1.905 0) (size 0.8 3) (layers B.Cu B.Mask))
  (pad "" np_thru_hole circle (at -2.54 -1.905) (size 0.7 0.7) (drill 0.7) (layers *.Cu *.Mask))
  (pad "" np_thru_hole circle (at -1.27 -1.905) (size 0.7 0.7) (drill 0.7) (layers *.Cu *.Mask))
  (pad "" np_thru_hole circle (at 0 -1.905) (size 0.7 0.7) (drill 0.7) (layers *.Cu *.Mask))
  (pad "" np_thru_hole circle (at 1.27 -1.905) (size 0.7 0.7) (drill 0.7) (layers *.Cu *.Mask))
  (pad "" np_thru_hole circle (at 2.54 -1.905) (size 0.7 0.7) (drill 0.7) (layers *.Cu *.Mask))
)
