(module "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias" (layer F.Cu) (tedit 5EEFB632)
  (descr "SOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lm5017.pdf#page=31), generated with kicad-footprint-generator ipc_gullwing_generator.py")
  (tags "SOIC SO")
  (attr smd)
  (fp_text reference "U16" (at -0.05 4.4 90) (layer F.SilkS))
  (fp_text value "AP64501SP-13" (at 0 3.4) (layer F.Fab))
  (fp_text user "${REFERENCE}" (at 0 0) (layer F.Fab))
  (pad "" smd roundrect (at 0.68 0.85) (size 1.13 1.42) (layers "F.Paste") (roundrect_rratio 0.2212389380530974))
  (pad "" smd roundrect (at 0.68 -0.85) (size 1.13 1.42) (layers "F.Paste") (roundrect_rratio 0.2212389380530974))
  (pad "" smd roundrect (at -0.68 0.85) (size 1.13 1.42) (layers "F.Paste") (roundrect_rratio 0.2212389380530974))
  (pad "" smd roundrect (at -0.68 -0.85) (size 1.13 1.42) (layers "F.Paste") (roundrect_rratio 0.2212389380530974))
  (pad "9" smd rect (at 0 0) (size 1.8 4.4) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1))
  (pad "9" thru_hole circle (at 0.65 1.95) (size 0.5 0.5) (drill 0.25) (layers *.Cu))
  (pad "9" thru_hole circle (at -0.65 1.95) (size 0.5 0.5) (drill 0.25) (layers *.Cu))
  (pad "9" thru_hole circle (at 0.65 0.65) (size 0.5 0.5) (drill 0.25) (layers *.Cu))
  (pad "9" thru_hole circle (at -0.65 0.65 270) (size 0.5 0.5) (drill 0.25) (layers *.Cu))
  (pad "9" thru_hole circle (at 0.65 -0.65) (size 0.5 0.5) (drill 0.25) (layers *.Cu))
  (pad "9" thru_hole circle (at -0.65 -0.65) (size 0.5 0.5) (drill 0.25) (layers *.Cu))
  (pad "9" thru_hole circle (at 0.65 -1.95) (size 0.5 0.5) (drill 0.25) (layers *.Cu))
  (pad "9" thru_hole circle (at -0.65 -1.95) (size 0.5 0.5) (drill 0.25) (layers *.Cu)
    (solder_mask_margin 0.3))
  (pad "9" smd rect (at 0 0) (size 2.95 4.9) (layers "F.Cu"))
  (pad "" smd rect (at 0 0) (size 2.71 3.4) (layers "F.Mask"))
  (pad "8" smd roundrect (at 2.5625 -1.905) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  (pad "7" smd roundrect (at 2.5625 -0.635) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  (pad "6" smd roundrect (at 2.5625 0.635) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  (pad "5" smd roundrect (at 2.5625 1.905) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  (pad "4" smd roundrect (at -2.5625 1.905) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  (pad "3" smd roundrect (at -2.5625 0.635) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  (pad "2" smd roundrect (at -2.5625 -0.635) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  (pad "1" smd roundrect (at -2.5625 -1.905) (size 1.775 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25))
  (model "${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm.wrl"
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
