(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (title_block
    (title "NFC PCB Business Card Layout")
    (date "2023-07-16")
    (rev "A")
    (company "Yash Fichadia")
    (comment 1 "Copyright (c) 2023")
    (comment 2 "Designer: YAF")
    (comment 3 "Reviewer: YAF")
    (comment 4 "Approved: YAF")
  )
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "../Gerbers/")
    )
  )
  (net 0 "")
  (net 1 "Net-(11-LA)")
  (net 2 "Net-(11-VSS)")
  (net 3 "Net-(11-VCC)")
  (net 4 "Net-(11-LB)")
  (net 5 "Net-(D1-A)")
  (net 6 "Net-(11-SCL)")
  (net 7 "Net-(11-FD)")
  (net 8 "Net-(11-SDA)")
  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_Vertical" (layer "F.Cu")
    (at 175.26 101.859)
    (descr "Through hole straight pin header, 1x05, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x05 2.54mm single row")
    (property "Sheetfile" "NewBusinessCard.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Generic connector, single row, 01x05, script generated")
    (property "ki_keywords" "connector")
    (attr through_hole)
    (fp_text reference "J1" (at 0 -2.33) (layer "F.SilkS"))
    (fp_text value "Conn_01x05_Pin" (at 0 12.49) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 5.08 90) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 3 "Net-(11-VCC)") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 2 "Net-(11-VSS)") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 7 "Net-(11-FD)") (pinfunction "Pin_3") (pintype "passive"))
    (pad "4" thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 8 "Net-(11-SDA)") (pinfunction "Pin_4") (pintype "passive"))
    (pad "5" thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 6 "Net-(11-SCL)") (pinfunction "Pin_5") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x05_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (at 155.9835 104.772)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "NewBusinessCard.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Resistor")
    (property "ki_keywords" "R res resistor")
    (attr smd)
    (fp_text reference "R1" (at 0 -1.135 unlocked) (layer "F.SilkS"))
    (fp_text value "47" (at 0 1.43) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "Net-(11-VCC)") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "Net-(D1-A)") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Diode_SMD:D_0805_2012Metric_Pad1.15x1.40mm_HandSolder" (layer "F.Cu")
    (at 155.951 100.327)
    (descr "Diode SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "diode handsolder")
    (property "Sheetfile" "NewBusinessCard.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Light emitting diode")
    (property "ki_keywords" "LED diode")
    (attr smd)
    (fp_text reference "D1" (at 0.005 -1.516 unlocked) (layer "F.SilkS"))
    (fp_text value "LED" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.025 0) (size 1.15 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2173913043)
      (net 2 "Net-(11-VSS)") (pinfunction "K") (pintype "passive"))
    (pad "2" smd roundrect (at 1.025 0) (size 1.15 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2173913043)
      (net 5 "Net-(D1-A)") (pinfunction "A") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Diode_SMD.3dshapes/D_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (at 156.1135 107.947)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "NewBusinessCard.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (attr smd)
    (fp_text reference "C1" (at 0 -1.262 unlocked) (layer "F.SilkS"))
    (fp_text value "220n" (at 0 1.43) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "Net-(11-VCC)") (pintype "passive"))
    (pad "2" smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Net-(11-VSS)") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_SO:TSSOP-8_3x3mm_P0.65mm" (layer "F.Cu")
    (at 156.376 111.298 180)
    (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)")
    (tags "SSOP 0.65")
    (property "Sheetfile" "NewBusinessCard.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "11" (at 0 -2.245 180 unlocked) (layer "F.SilkS"))
    (fp_text value "~" (at 0 2.55 180) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 180) (layer "F.Fab"))
    (pad "1" smd rect (at -2.15 -0.975 180) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "Net-(11-LA)") (pinfunction "LA") (pintype "bidirectional"))
    (pad "2" smd rect (at -2.15 -0.325 180) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "Net-(11-VSS)") (pinfunction "VSS") (pintype "bidirectional"))
    (pad "3" smd rect (at -2.15 0.325 180) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "Net-(11-SCL)") (pinfunction "SCL") (pintype "bidirectional"))
    (pad "4" smd rect (at -2.15 0.975 180) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "Net-(11-FD)") (pinfunction "FD") (pintype "bidirectional"))
    (pad "5" smd rect (at 2.15 0.975 180) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "Net-(11-SDA)") (pinfunction "SDA") (pintype "bidirectional"))
    (pad "6" smd rect (at 2.15 0.325 180) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "Net-(11-VCC)") (pinfunction "VCC") (pintype "bidirectional"))
    (pad "7" smd rect (at 2.15 -0.325 180) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "Net-(11-VCC)") (pinfunction "VOUT") (pintype "bidirectional"))
    (pad "8" smd rect (at 2.15 -0.975 180) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "Net-(11-LB)") (pinfunction "LB") (pintype "bidirectional"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-8_3x3mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "NFCBusinessCardProject:25X48MM_NFC" (layer "F.Cu")
    (at 154.47 131.579)
    (descr "NFC loop antenna 2,75 µH")
    (property "Sheetfile" "NewBusinessCard.kicad_sch")
    (property "Sheetname" "")
    (fp_text reference "12" (at 0 -8.13 unlocked) (layer "F.SilkS"))
    (fp_text value "~" (at 0 0) (layer "F.Fab"))
    (pad "P$1" smd rect (at -0.635 -13.205 90) (size 1.01 0.3) (layers "F.Cu")
      (net 1 "Net-(11-LA)") (pinfunction "P$1") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 45))
    (pad "P$2" thru_hole circle (at 0.635 -9.525) (size 0.808 0.808) (drill 0.3) (layers "*.Cu" "*.Mask")
      (net 4 "Net-(11-LB)") (pinfunction "P$2") (pintype "bidirectional") (solder_mask_margin 0.1016))
  )
  (gr_line (start 179.832 56.597) (end 179.832 145.547)
    (layer "Edge.Cuts"))
  (gr_line (start 129.032 145.547) (end 179.832 145.547)
    (layer "Edge.Cuts"))
  (gr_line (start 129.032 56.597) (end 179.832 56.597)
    (layer "Edge.Cuts"))
  (gr_line (start 129.032 56.597) (end 129.032 145.547)
    (layer "Edge.Cuts"))
  (gr_text "SCL" (at 170.434 112.776) (layer "F.SilkS"))
  (gr_text "FD" (at 170.434 107.696) (layer "F.SilkS"))
  (gr_text "VSS" (at 170.434 105.156) (layer "F.SilkS"))
  (gr_text "SDA" (at 170.434 110.236) (layer "F.SilkS"))
  (gr_text "VCC" (at 170.434 102.616) (layer "F.SilkS"))
)
